Piana Cross Lapping Technology

Piana Cross Lapping Technology transforms single layer or dual carded layers of web into multiple stacked layers through lapping process to create a nonwoven with wide range of thickness and basis weight for various applications.

Piana Cross Lapping Technology delivers uniform and top quality profile across the length and width of product at high production speed.

Piana Cross Lapping Technology utilizes high performance treated fibers patented by Piana Group to provide unique, inexpensive, and efficient solutions for flame retardant and antimicrobial applications.

Technical features

Insulation
Breathability
Soundproofing
Temperature Management
Lightweight
Soft Touch

Capabilities

Fiber Blends

Natural and synthetic blends can be used in the process

Highly customizable

Wide range of denier from 1 to 15; wide range of thickness 2-50 mm; wide range of basis weight

Lamination

Scrim lamination for delicate cross lap

Eco-sustainable

Recyclable fibers can be used in the process

Light weight

Light weight nonwoven pad

Chemical functionality

Flame retardant barrier and custom chemical functionality

Anti-microbial

Anti-microbial nonwoven pad

Soundproofing

Sound barrier nonwoven pad

Insulation

Temperature Management